POWER GRID BALANCING APPARATUS, SYSTEM AND METHOD
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United States of America Patent
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Issued Date -
Jun 22, 2017
app pub date -
Dec 16, 2015
filing date -
Dec 16, 2015
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Abstract
A semiconductor apparatus for power distribution on a die, the semiconductor apparatus, comprising a first die, wherein the first die comprises a first integrated circuit, a dam coupled to the first die, wherein the dam is a metal ring, a second die, wherein the second die comprises a second integrated circuit, wherein the first and second dies are stacked together and are electrically connected, and a pair of metal connectors coupled to the dam and an edge of the first die, wherein power and ground wires are coupled to the dam, wherein the power transmitted through the power and ground wires is distributed through the dam and metal connectors to the first die and wherein the power transmitted to the first die is distributed to the to the second die.
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