METHOD OF MAKING A STACKED INDUCTOR-ELECTRONIC PACKAGE
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United States of America Patent
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Issued Date -
Jun 22, 2017
app pub date -
Mar 8, 2017
filing date -
Dec 7, 2009
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Abstract
An embodiment of a circuit includes a circuit module and an inductor disposed over and electrically coupled to the module. Disposing the inductor over the module may reduce the area occupied by the circuit as compared to a circuit where the inductor is disposed adjacent to the module, or to a circuit where the inductor is disposed in the module adjacent to other components of the module. Furthermore, disposing the inductor outside of the module may allow one to install or replace the inductor.
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