Plurality of substrates bonded by direct bonding of copper recesses
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United States of America Patent
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Jan 9, 2018
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N/A
app pub date -
Mar 2, 2017
filing date -
May 21, 2014
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Abstract
A structure includes a substrate having an upper surface provided with recesses and coated with a continuous barrier layer topped with a continuous copper layer filling at least the recesses. The structure is planarized by a chemical-mechanical polishing of the copper, such a polishing being selective with respect to the barrier layer so that copper remains in the recesses and is coplanar with the upper surface of the substrate. Two such structures are then direct bonded to each other (copper to copper) with opposite areas having a same topology.
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