FLIP-CHIP PACKAGE WITH THERMAL DISSIPATION LAYER
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United States of America Patent
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Issued Date -
Jun 22, 2017
app pub date -
Dec 21, 2015
filing date -
Dec 21, 2015
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Abstract
Embodiments herein may relate to a flip-chip chip scale package (FCCSP) with a thermal dissipation layer to dissipate heat from the FCCSP during operation of the FCCSP. The thermal dissipation layer may be applied to a surface of the FCCSP through a sputter coating process and may operate as a heat spreader for the FCCSP. Other embodiments may be described and/or claimed.
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