Pulsed-mode direct-write laser metallization

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United States of America Patent

PATENT NO 10622244
APP PUB NO 20170178946A1
SERIAL NO

15124036

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Abstract

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A method for manufacturing includes coating a substrate (22) with a matrix (28) containing a material to be patterned on the substrate. A pattern is fixed in the matrix by directing a pulsed energy beam to impinge on a locus of the pattern so as to cause adhesion of the material to the substrate along the pattern without fully sintering the material in the pattern. The matrix remaining on the substrate outside the fixed pattern is removed, and after removing the matrix, the material in the pattern is sintered.

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Patent Owner(s)

Patent OwnerAddress
ORBOTECH LTDISRAEL JAVNE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ankri, Jonathan Ramle, IL 3 14
Ermak, Oleg Netanya, IL 2 4
Kotler, Zvi Tel Aviv, IL 49 618
Rotnemer, Abraham Jerusalem, IL 2 4
Zenou, Michael Hashmonaim, IL 79 355

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