THIN METAL FILM SUBSTRATE AND METHOD FOR PREPARING THE SAME

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United States of America Patent

SERIAL NO

15122064

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Abstract

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The present disclosure related to a thin metal film substrate and a method for preparing the same and more particularly, to a thin metal film substrate including a substrate; and a thin metal film comprising Ag or an Ag alloy formed on the substrate, wherein the thin metal film is formed to have preferred orientation corresponding to the preferred orientation of the substrate during the initial growth. The thin metal film substrate according to an example grows in a 2D continuous thin film from the initial growth to provide excellent light transmittance and conductivity.

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Patent Owner(s)

Patent OwnerAddress
KOREA INSTITUTE OF MACHINERY & MATERIALSDAEJEON KOREA DAEJEON

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Gun Hwan Pyeongtaek-si, Gyeonggi-do, KR 8 14
Lee, Sung Hun Changwon-si, Gyeongsangnam-do, KR 66 778
Song, Myung Kwan Jung-gu, Ulsan, KR 3 0
Yun, Jung Heum Gimhae-si, Gyeongsangnam-do, KR 7 14
Zhao, Guo Qing Gimhae-si, Gyeongsangnam-do, KR 1 0

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