MOISTURE CURABLE SILICONE COMPOSITION

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United States of America Patent

SERIAL NO

15115927

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides curable compositions comprising (A) an polymer having a reactive silicon-containing group, (B) a cross-linker and/or a chain extender, (C) a non-tin metal catalyst, (D) an adhesion promoter, (E) optionally a filler, (F) optionally cure accelerator. The above curable compositions exhibit excellent adhesiveness, deep section cure, stable curability even after storage and/or retained physical properties even after subjecting to the accelerated humidity and temperatures.

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Patent Owner(s)

Patent OwnerAddress
MOMENTIVE PERFORMANCE MATERIALS INC260 HUDSON RIVER ROAD WATERFORD NY 12188

International Classification(s)

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  • 2015 Application Filing Year
  • C08G Class
  • 2777 Applications Filed
  • 2224 Patents Issued To-Date
  • 80.09 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201520162017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dinkar, Sumi Bangalore, IN 22 46

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Patent Citation Ranking

  • 2 Citation Count
  • C08G Class
  • 33.97 % this patent is cited more than
  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges430756472072111101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7091 - 100100 +050100150200250300350400450500550600650700750800

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