SURFACE MOUNTABLE LIGHT EMITTING DIODE DEVICES

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United States of America Patent

APP PUB NO 20170170369A1
SERIAL NO

14966659

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Abstract

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A surface-mountable light emitting diode (LED) assembly and a method for making the surface-mountable LED assembly is disclosed. In one embodiment, the surface-mountable LED assembly includes an LED comprising a first layer having a first conductivity type, a second layer having a second conductivity type, and a light emitting layer between the first layer and the second layer. A transparent substrate is bonded to the LED via a transparent bonding layer disposed between the transparent substrate and the LED. In one embodiment, the transparent substrate comprises an amorphous solid, such as glass.

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Patent Owner(s)

Patent OwnerAddress
TOSHIBA CORPORATION1-1 SHIBAURA 1-CHOME MINATO-KU TOKYO 105-8001

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chuang, Chih-Wei Albany, US 69 587
Lin, Chao-Kun San Jose, US 50 864

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