INTERPOSER STRUCTURE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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N/A
Issued Date -
Jun 15, 2017
app pub date -
Dec 30, 2015
filing date -
Dec 11, 2015
priority date (Note) -
Published
status (Latency Note)
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Abstract
An interposer structure and a manufacturing method thereof are provided. The interposer structure includes a flexible substrate, a plurality of conductive pillars, a first patterned conductive layer, and a second patterned conductive layer. The flexible substrate includes a first surface and a second surface opposite to the first surface and has a plurality of through holes extending from the first surface to the second surface. A material of the flexible substrate is an insulator. The conductive pillars are disposed in the through holes. The first patterned conductive layer is disposed on the first surface of the flexible substrate and is electrically connected to the conductive pillars. The second patterned conductive layer is disposed on the second surface of the flexible substrate and is electrically connected to the conductive pillars.
First Claim
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Family
| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| TW | B | TWI613781 | Dec 11, 2015 |
International Classification(s)
- 2015 Application Filing Year
- H01L Class
- 25498 Applications Filed
- 22451 Patents Issued To-Date
- 88.06 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 8 Age