Selective, electrochemical etching of a semiconductor

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United States of America Patent

PATENT NO 9922838
SERIAL NO

15116041

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Abstract

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Methods for facilitating fabricating semiconductor structures are provided which include: providing a multilayer structure including a semiconductor layer, the semiconductor layer including a dopant and having an increased conductivity; selectively increasing, using electrochemical processing, porosity of the semiconductor layer, at least in part, the selectively increasing porosity utilizing the increased conductivity of the semiconductor layer; and removing, at least in part, the semiconductor layer with the selectively increased porosity from the multilayer structure. By way of example, the selectively increasing porosity may include selectively, anodically oxidizing, at least in part, the semiconductor layer of the multilayer structure.

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Patent Owner(s)

Patent OwnerAddress
RENSSELAER POLYTECHNIC INSTITUTE110 8TH STREET J BUILDING TROY NY 12180

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bhat, Ishwara B Clifton Park, US 6 63
Chow, Tat-Sing Niskayuna, US 1 6
Dahal, Rajendra P Troy, US 5 43

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