APPARATUS FOR CUTTING SUPER ABSORBENT POLYMER AND METHOD FOR PREPARING SUPER ABSORBENT POLYMER USING SAME

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United States of America Patent

SERIAL NO

15115418

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Abstract

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The present invention relates to an apparatus for cutting a super absorbent polymer and a method for preparing a super absorbent polymer using the same. The apparatus for cutting a super absorbent polymer of the present invention includes: an injection part for injecting a super absorbent polymer; a first cutter for primarily cutting the super absorbent polymer; a second cutter for secondarily cutting the super absorbent polymer; and a discharging part for discharging the cut super absorbent polymer.

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Patent Owner(s)

Patent OwnerAddress
HANWHA CHEMICAL CORPORATION86 CHEONGGYECHEON-RO JUNG-GU SEOUL 04541

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Dae Keon Jeollabuk-do, KR 7 12
Kim, Eui Duk Daejeon, KR 10 29
Kim, Ji Yeon Daegu, KR 146 611
Lee, Min Ho Daejeon, KR 84 425
Oh, Seok Heon Daejeon, KR 12 31
Paik, Choong Hoon Daejeon, KR 6 12
Sim, Yu Jin Daejeon, KR 7 12

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