Device for the separate application of bonding material deposits

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10695853
APP PUB NO 20170165773A1
SERIAL NO

15323808

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A device for the application of solder material deposits includes a conveying device for conveying solder material deposits from a reservoir at an upper housing part toward an application device at a lower housing part. The conveying device can be moved from a receiving position P1 to a transfer position P2, in which the solder material deposit is exposed to a pressure gas via a pressure bore formed in the upper housing part and from which the solder material deposit is transferred to an application nozzle in an application position P3. The application device includes an application duct formed in the lower housing and forms a lower section of a transmission duct which serves to transmit laser radiation to the solder in the application nozzle. The application duct is inclined at an application angle α with respect to the rotation axis.

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Patent Owner(s)

Patent OwnerAddress
PAC TECH - PACKAGING TECHNOLOGIES GMBH14641 NAUEN

International Classification(s)

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  • 2015 Application Filing Year
  • B23K Class
  • 2354 Applications Filed
  • 1765 Patents Issued To-Date
  • 74.98 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Azdasht, Ghassem Berlin, DE 59 605
Krause, Thorsten Velten, DE 97 635

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Patent Citation Ranking

  • 0 Citation Count
  • B23K Class
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  • 5 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges804481103101 - 1011 - 2021 - 3031 - 40050100150200250300350400450500550600650700750800850

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