SOLDER BALL FEEDING DEVICE
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United States of America Patent
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app pub date -
Jul 15, 2015
filing date -
Jul 15, 2014
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Abstract
The invention relates to a solder ball feeding device (40), comprising a solder ball reservoir (20) for receiving an amount of solder balls and a metering device (31) for dispensing a metered feeding amount of solder balls (16) to a discharge device (11), wherein the metering device comprises an ultrasound device (32) and a dispensing nozzle (21) with a dispensing cannula (43), the ultrasound device serving to apply vibrations to the dispensing nozzle, and the solder ball reservoir or the dispensing nozzle of the solder ball reservoir being provided with a pressure connection (23) which serves to introduce a pressurized gas into the solder ball feeding device.
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