Method for applying a bonding layer

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United States of America Patent

PATENT NO 9911713
SERIAL NO

15441741

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Abstract

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A method for applying a bonding layer that is comprised of a basic layer and a protective layer on a substrate with the following method steps: application of an oxidizable basic material as a basic layer on a bonding side of the substrate, at least partial covering of the basic layer with a protective material that is at least partially dissolvable in the basic material as a protective layer. In addition, the invention relates to a corresponding substrate.

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Patent Owner(s)

Patent OwnerAddress
EV GROUP E THALLNER GMBHDI ERICH THALLNER STRASSE 1 ST FLORIAN AM INN A-4782

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wimplinger, Markus Ried, AT 79 805

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