SPIN CHUCK WITH HEATED NOZZLE ASSEMBLY
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 8, 2017
app pub date -
Dec 4, 2015
filing date -
Dec 4, 2015
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
An apparatus for processing wafer-shaped articles comprises a process chamber and a spin chuck positioned inside the process chamber. The spin chuck is configured to hold a wafer-shaped article at a predetermined process position. A nozzle assembly extends into the process chamber such that a discharge end of the nozzle assembly faces the predetermined process position. The nozzle assembly is equipped with a heater that heats portions of the nozzle assembly located within the process chamber. Such heating may be performed, for example, to promote evaporation of liquid droplets from the nozzle assembly.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully