COMPOSITION, USE THEREOF AND METHOD FOR ELECTRODEPOSITING GOLD CONTAINING LAYERS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
N/A
app pub date -
Aug 21, 2015
filing date -
Aug 25, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to a composition and method for electrodepositing gold containing layers using the composition and the use of mercapto-triazole compounds as anti-immersion additives. The composition contains a mercapto-triazole compound which acts as an anti-immersion additive. The composition and method are suited for depositing functional or hard gold or gold alloys that can be applied in the industry as contact material of electrical connectors for high reliability applications.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
ATOTECH DEUTSCHLAND GMBH | ERASMUSSTRASSE 20 BERLIN 10553 |
International Classification(s)

- 2015 Application Filing Year
- C25D Class
- 672 Applications Filed
- 475 Patents Issued To-Date
- 70.69 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
BREITFELDER, Jana | Berlin, DE | 3 | 3 |
# of filed Patents : 3 Total Citations : 3 | |||
KURTZ, Olaf | Berlin, DE | 15 | 99 |
# of filed Patents : 15 Total Citations : 99 | |||
RUETHER, Robert | Lehnitz, DE | 5 | 8 |
# of filed Patents : 5 Total Citations : 8 |
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Patent Citation Ranking
- 2 Citation Count
- C25D Class
- 36.72 % this patent is cited more than
- 8 Age
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