COMPOSITION, USE THEREOF AND METHOD FOR ELECTRODEPOSITING GOLD CONTAINING LAYERS

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United States of America Patent

SERIAL NO

15327389

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Abstract

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The present invention relates to a composition and method for electrodepositing gold containing layers using the composition and the use of mercapto-triazole compounds as anti-immersion additives. The composition contains a mercapto-triazole compound which acts as an anti-immersion additive. The composition and method are suited for depositing functional or hard gold or gold alloys that can be applied in the industry as contact material of electrical connectors for high reliability applications.

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Patent Owner(s)

Patent OwnerAddress
ATOTECH DEUTSCHLAND GMBHERASMUSSTRASSE 20 BERLIN 10553

International Classification(s)

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  • 2015 Application Filing Year
  • C25D Class
  • 672 Applications Filed
  • 475 Patents Issued To-Date
  • 70.69 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201520162017201820192020202120220255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BREITFELDER, Jana Berlin, DE 3 3
KURTZ, Olaf Berlin, DE 15 99
RUETHER, Robert Lehnitz, DE 5 8

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Patent Citation Ranking

  • 2 Citation Count
  • C25D Class
  • 36.72 % this patent is cited more than
  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges213330255411101 - 1011 - 2021 - 3031 - 4051 - 6061 - 70100 +020406080100120140160180200220240260280300320340360

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