ADHESIVE TAPE, ELECTRONIC DEVICE, AND METHOD FOR DISMANTLING ARTICLE

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United States of America Patent

APP PUB NO 20170158916A1
SERIAL NO

15320487

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Abstract

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An object of the present invention is to provide an adhesive tape that has very good adhesion in a temperature range of not greater than 60° C. and that rapidly decreases its adhesion after heating for a short period of time. The invention relates to an adhesive tape including a rubber-based adhesive layer. The storage modulus G120 of the adhesive component present in the adhesive layer at 120° C. is 1.0×103 to 2.0×105 Pa. The ratio (G23/G120) of the storage modulus G23 of the adhesive component at 23° C. to the storage modulus G120 is 1 to 20.

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Patent Owner(s)

Patent OwnerAddress
DIC CORPORATION35-58 SAKASHITA 3-CHOME ITABASHI-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akiyama, Seiji Saitama, JP 18 113
Morino, Akinori Saitama, JP 14 32

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