HIGHLY FLOWABLE POLYAMIDE RESIN
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United States of America Patent
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Jun 29, 2015
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Jul 15, 2014
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Abstract
A resin has a viscosity of 10 Pa·s or less at a shear rate of 1 s−1 at 150° C. and a viscosity of 100 Pa·s or more at a shear rate of 1 s−1 at 125° C., the resin having a low viscosity that allows easy penetration into strands of a wire harness at a heat shrinkage temperature and having a high viscosity that does not allow flowing of the resin at a temperature at which the wire harness is used. In particular, a highly flowable polyamide resin includes an acid component (a) containing, as a main component, a polymerized fatty acid which contains a dimer acid having 16 to 48 carbon atoms and in which the content of the dimer acid is 30% by mass or more, an acid component (b) containing, as a main component, a dibasic acid selected from the group consisting of dicarboxylic acids having 6 to 22 carbon atoms and ester derivatives thereof, and an amine component (c) containing a diamine as a main component, the acid component (a), the acid component (b), and the amine component (c) being linked by amide bonds, in which the mass ratio of the acid component (a) to the acid component (b) is in a predetermined range.
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