THERMOSETTING RESIN COMPOSITION, POLYAMIDE, ADHESIVE SHEET, CURED PRODUCT, AND PRINTED-WIRING BOARD

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United States of America Patent

SERIAL NO

15323222

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Abstract

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A thermosetting resin composition excellent in dimensional stability during curing and adhesiveness, heat resistance, moist heat resistance, electrical insulating properties, flexibility, low dielectric properties and low dissipation factor properties after curing is provided.

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Patent Owner(s)

Patent OwnerAddress
TOYO INK SC HOLDINGS CO LTD2-1 KYOBASHI 2-CHOME CHUO-KU TOKYO 1040031 ?1040031

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KISHI, Daisuke Tokyo, JP 4 17
KOBAYASHI, Hidenobu Tokyo, JP 6 42
MATSUDO, Kazunori Tokyo, JP 4 5
OGIWARA, Naoto Tokyo, JP 1 3
SAKAGUCHI, Go Tokyo, JP 1 3

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