COOLED POWER ELECTRONIC ASSEMBLY
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United States of America Patent
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Issued Date -
Jun 1, 2017
app pub date -
Nov 30, 2015
filing date -
Nov 30, 2015
priority date (Note) -
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Abstract
A power electronic assembly comprising a power electronic module incorporating multiple of semiconductor power electronic switch components, the power electronic module comprising a base plate, a vapour chamber having one or more condenser pipes in fluid communication with the vapour chamber, the vapour chamber and the one or more condenser pipes forming a closed volume and enclosing a working fluid, a mounting plate having an indent for receiving the vapour chamber and one or more apertures for receiving the one or more condenser pipes, wherein the power electronic module is attached to the mounting plate to transfer heat from the base plate of the power electronic module to the vapour chamber.
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