INTEGRATED MEMS MICROPHONE AND VIBRATION SENSOR
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United States of America Patent
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May 23, 2017
Grant Date -
Jun 1, 2017
app pub date -
Jan 25, 2016
filing date -
Dec 1, 2015
priority date (Note) -
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Abstract
MEMS microphone and vibration sensor dies and packages are described. In an embodiment, a MEMS microphone and vibration sensor die includes a die substrate, a MEMS microphone on the die substrate and a MEMS vibration sensor on the die substrate. The MEMS vibration sensor may include a plurality of beams with different proof masses corresponding to different resonant frequencies, wherein the different proof masses comprise a same material as the die substrate.
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