SURFACE ACOUSTIC WAVE (SAW) RESONATOR STRUCTURE WITH DIELECTRIC MATERIAL BELOW ELECTRODE FINGERS

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United States of America Patent

SERIAL NO

14954954

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Abstract

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A surface acoustic wave (SAW) resonator structure includes a substrate, a piezoelectric layer disposed on the substrate, and an interdigital transducer (IDT) electrode disposed over the piezoelectric layer. The IDT electrode includes multiple busbars and multiple electrode fingers extending from each busbar, where the electrode fingers are configured to generate surface acoustic waves in the piezoelectric layer. The SAW resonator structure further includes dielectric material disposed between the piezoelectric layer and at least at portion of the IDT. The dielectric material may be positioned below tips of the electrode fingers, thereby mass-loading the electrode fingers.

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Patent Owner(s)

Patent OwnerAddress
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE LTDSINGAPORE SINGAPORE SINGAPORE CITY SINGAPORE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gilbert, Stephen Roy San Francisco, US 17 403
Kaitila, Jyrki Riemerling, DE 23 1599
Larson,, III John D Palo Alto, US 27 723
Parker, Reed Saratoga, US 3 25
Ruby, Richard C Menlo Park, US 126 7330

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