Radio frequency die package with inverted ground plane and method of making same
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United States of America Patent
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Oct 31, 2017
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N/A
app pub date -
Feb 10, 2017
filing date -
Aug 28, 2015
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Abstract
A radio frequency (RF) die package includes a switch assembly comprising an RF transmission line and a plurality of conductive mounting pads formed on a first substrate. A switching mechanism selectively couples a first portion of the RF transmission line to a second portion of the RF transmission line. An inverted ground plane assembly is coupled to the plurality of conductive mounting pads such that an electromagnetic field generated between the RF transmission line and the inverted ground plane assembly does not permeate the first substrate in a region of the switch assembly proximate the switching mechanism.
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