SEMICONDUCTOR DEVICE

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United States of America Patent

SERIAL NO

15173749

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Abstract

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A semiconductor device includes: a semiconductor substrate; a device region on the semiconductor substrate; a planar edge termination region on the semiconductor substrate to surround the device region; and a passivation film covering the edge termination region, wherein the passivation film includes a semi-insulating film directly contacting the semiconductor substrate.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ELECTRIC CORPORATION7-3 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO 100-8310

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, Ze Tokyo, JP 97 269
HARADA, Tatsuo Tokyo, JP 33 1510
HONDA, Shigeto Tokyo, JP 18 45
NISHII, Akito Tokyo, JP 8 53

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