METHOD FOR SINGULATING A MULTIPLICITY OF CHIPS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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N/A
Issued Date -
N/A
app pub date -
Nov 30, 2016
filing date -
Nov 30, 2015
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method for singulating a multiplicity of chips is provided. Each chip includes a substrate, an active region arranged at least one of in or on the substrate, at least one electronic component being formed in said active region, and a dielectric above the active region. The method includes forming at least one first trench between the chips. The at least one first trench is formed through the dielectric and the active regions and extends into the substrate. The method further includes sawing the substrate material from the opposite side of the substrate relative to the first trench along a sawing path corresponding to the course of at least one first trench, such that at least one second trench is formed. The width of the at least one first trench is less than or equal to the width of the at least one second trench.
First Claim
Other Claims data not available