SAM ASSISTED SELECTIVE E-LESS PLATING ON PACKAGING MATERIALS
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United States of America Patent
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Jun 1, 2017
app pub date -
Nov 30, 2015
filing date -
Nov 30, 2015
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Abstract
A method including activating an area of a polymer layer on a substrate with electromagnetic radiation; modifying the activated area; forming a self-assembled monolayer on the modified active area; reacting the self-assembled monolayer with the self-assembled monolayer; and reacting the self-assembled monolayer with a conductive material. A method including activating an area of a polymer dielectric layer on a substrate with electromagnetic radiation, the area selected for an electrically conductive line; modifying the activated area; forming a self-assembled monolayer on the modified active area; reacting the self-assembled monolayer with a catalyst; and electroless plating a conductive material on the self-assembled monolayer.
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