METHOD FOR SILKSCREEN PRINTING DURING MANUFACTURE OF PRINTED CIRCUIT BOARD
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United States of America Patent
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Issued Date -
May 25, 2017
app pub date -
Mar 21, 2016
filing date -
Nov 20, 2015
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Abstract
A method for silkscreen printing during manufacture of a printed circuit board includes forming a circuit pattern on a trepanned circuit board using a first silkscreen plate that has the circuit pattern, the scraper, and conductive inks, forming a solder mask layer on the circuit board using a second silkscreen plate, the scraper, and a solder material, forming words and marks on the circuit board using a third silkscreen plate, the scraper, and inks, and forming a solder paste layer on the circuit board using a fourth silkscreen plate, the scraper, and solder paste.
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