LIQUID COOLING APPARATUS, PROJECTOR AND APPARATUS HAVING A HEAT SOURCE
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United States of America Patent
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Issued Date -
May 25, 2017
app pub date -
Feb 2, 2016
filing date -
Nov 24, 2015
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Abstract
In a liquid cooling apparatus, a projector and an apparatus having a heat source, the liquid cooling apparatus includes a chassis and a cover. The chassis has upper and lower surfaces, a boss protruded from the lower surface, and a recessed groove formed on the upper surface and inside the boss. The boss has an area smaller than 50% of the area of the lower surface. The cover covers the chassis, and a cavity is formed inside the cover and the chassis. The cover has liquid inlet and outlet channels communicated with the cavity. The recessed groove improves the thermal conduction and heat exchange performance of the liquid cooling apparatus. The boss has an area smaller than 50% of the area of the lower surface and is thermally attached to the heat source more securely to provide excellent heat dissipating efficiency to both projector and liquid cooling apparatus.
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