SPIN CHUCK WITH IN SITU TEMPERATURE MONITORING
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United States of America Patent
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Nov 20, 2015
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Nov 20, 2015
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Abstract
A device for processing wafer-shaped articles comprises a rotary chuck mounted for rotation within a surrounding enclosure. The rotary chuck has mounted therein at least one sensor, a microprocessor connected to the at least one sensor so as to receive output signals therefrom, and a wireless transmitter connected to the microprocessor so as to receive output signals therefrom and transmit signals exteriorly of the device.
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