FINGERPRINT SENSING MODULE

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United States of America Patent

APP PUB NO 20170147855A1
SERIAL NO

15145809

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A fingerprint sensing module includes a sensing unit having a sensing surface, a light source arranged beside the sensing unit, and an optical covering film arranged on the sensing unit. The optical covering film covers the sensing surface. The optical covering film includes a touching surface and a connecting surface opposite to the touching surface. The touching surface is suitable for being in touch with a finger of a user, and the connecting surface is connected to the sensing surface. A refractive index of the optical covering film increases from the connecting surface to the touching surface. The light source is suitable for emitting light to the touching surface, so as to irradiate the finger of the user.

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Patent Owner(s)

Patent OwnerAddress
GINGY TECHNOLOGY INCRM C6 3F NO 1 LIXING 1ST RD HSINCHU SCIENCE PARK HSINCHU CITY 30078

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wu, Jen-Chieh Hsinchu City, TW 63 503

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