Method and system for removing heat from multiple controllers on a circuit board
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United States of America Patent
Stats
-
Aug 7, 2018
Grant Date -
May 25, 2017
app pub date -
Feb 8, 2017
filing date -
Jun 7, 2013
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A heat sink including a top surface, a first bottom surface configured to thermally contact a first controller having a first height from a circuit board, and a second bottom surface configured to thermally contact a second controller having a second height from the circuit board, wherein the second height is different than the first height.
First Claim
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International Classification(s)
- 2017 Application Filing Year
- G06F Class
- 61356 Applications Filed
- 46481 Patents Issued To-Date
- 75.76 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- G06F Class
- 0 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Feb 7, 2026 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Feb 7, 2030 |
