Semiconductor substrate, epitaxial wafer, and method for manufacturing epitaxial wafer

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United States of America Patent

PATENT NO 10676841
APP PUB NO 20170145590A1
SERIAL NO

15309956

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A semiconductor substrate for being used as a base substrate for epitaxial crystal growth by HVPE method includes a β-Ga2O3-based single crystal, and a principal surface that is a plane parallel to a [010] axis of the β-Ga2O3-based single crystal. An epitaxial wafer includes the semiconductor substrate, and an epitaxial layer that includes a β-Ga2O3-based single crystal and is formed on the principal surface of the semiconductor substrate by epitaxial crystal growth using the HVPE method. A method for manufacturing the epitaxial wafer includes forming the epitaxial layer by epitaxial crystal growth using the HVPE method on the semiconductor substrate.

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Patent OwnerAddress
TAMURA CORPORATION1-19-43 HIGASHI-OIZUMI NERIMA-KU TOKYO 1788511

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Goto, Ken Tokyo, JP 30 470
Koukitu, Akinori Tokyo, JP 38 242
Kumagai, Yoshinao Fuchu, JP 28 183
Murakami, Hisashi Fuchu, JP 32 266

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