PLASTIC-CLADDING FILAMENT STRUCTURE
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United States of America Patent
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app pub date -
Jan 4, 2016
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Nov 19, 2015
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Abstract
An improved plastic-cladding filament structure includes a combined arrangement of a base layer, thermosetting polymer glue, and at least one conductive filament. The thermosetting polymer glue is combined with the base layer. The at least one conductive filament is enclosed and housed in the thermosetting polymer glue to allow the conductive filament to be attached to the base layer through heating and setting of the thermosetting polymer glue. By means of the property the thermosetting polymer glue that the thermosetting polymer glue gets set after being heated to a predetermined temperature and melted and shaped and once heated to get set and shaped, further heating does not change the shape, the thermosetting polymer glue that encloses and houses the conductive filament can be set to form any desired shape to facilitate combination thereof with the base layer.
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