Sintering materials and attachment methods using same
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United States of America Patent
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Jul 19, 2022
Grant Date -
May 25, 2017
app pub date -
Jun 12, 2015
filing date -
Jun 12, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.
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