LED ASSEMBLY FOR LED PACKAGE WITH SIDEWALL ELECTRODES
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United States of America Patent
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Issued Date -
May 18, 2017
app pub date -
Nov 17, 2015
filing date -
Nov 17, 2015
priority date (Note) -
Published
status (Latency Note)
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Abstract
The present disclosure provides a novel light-emitting diode assembly comprising a housing and an LED package having sidewall electrodes. The housing comprises sidewalls with contacts that are in electrical connection with electrodes of the LED package. The electrodes of the LED package are substantially exposed along the sidewalls of a resin carrier layer of the LED package.
First Claim
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