LED ASSEMBLY FOR LED PACKAGE WITH SIDEWALL ELECTRODES

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United States of America Patent

APP PUB NO 20170141278A1
SERIAL NO

14944038

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Abstract

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The present disclosure provides a novel light-emitting diode assembly comprising a housing and an LED package having sidewall electrodes. The housing comprises sidewalls with contacts that are in electrical connection with electrodes of the LED package. The electrodes of the LED package are substantially exposed along the sidewalls of a resin carrier layer of the LED package.

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Patent Owner(s)

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TOSHIBA CORPORATIONTOKYO JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hamaguchi, Norihito Morgan Hill, US 6 282
Lin, Chao-Kun San Jose, US 50 864

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges26979357140748325312788503629173801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050010001500200025003000350040004500500055006000650070007500800085009000950010000

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