PROCESS OF FORMING SEMICONDUCTOR DEVICE
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United States of America Patent
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May 18, 2017
app pub date -
Nov 15, 2016
filing date -
Nov 16, 2015
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Abstract
A process of forming a semiconductor device is disclosed, where the semiconductor device provides a base and a semiconductor chip that is mounted on the base through solder. The process includes steps of: (a) melting the solder by a heater that is provided within a block of a bonding apparatus, where the block mounts the base thereon and the base provides the solder thereon; (b) heating the semiconductor chip by radiation beams in advance to mount the semiconductor chip onto the base; and (c) placing the semiconductor chip onto the melted solder.
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