CHUCK PIN, METHOD FOR MANUFACTURING A CHUCK PIN, APPARATUS FOR TREATING A SUBSTRATE

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United States of America Patent

APP PUB NO 20170140977A1
SERIAL NO

15353454

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Abstract

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A chuck pin, method for manufacturing a chuck pin, and an apparatus for treating substrate. The substrate treating apparatus includes a container having a treating space in its inner side, a supporting unit supporting the substrate inside of the treating space, and a liquid supply unit providing a solution to the supported substrate of the supporting unit. The supporting unit is placed in a supporting plate where the substrate is placed and in the above supporting plate, and includes a chuck pin supporting a side part of the substrate. The chuck pin is formed on a body and on the above surface of the body, and includes a first coating film provided as a silicon carbide material.

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Patent Owner(s)

Patent OwnerAddress
SEMES CO LTD77 4SANDAN 5-GIL JIKSAN-EUP SEOBUK-GU CHEONAN-SI CHUNGCHEONGNAM-DO 31040
INDUSTRY ACADEMY COOPERATION FOUNDATION OF SEJONG UNIVERSITYSEOUL

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Won-Jun Seoul, KR 66 379
Ryu, Chong-Min Chungcheongbuk-do, KR 3 2
Seo, Seung-Ho Gyeonggi-do, KR 4 6

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