CONDUCTOR CONNECTION STRUCTURE, METHOD FOR PRODUCING SAME, CONDUCTIVE COMPOSITION, AND ELECTRONIC COMPONENT MODULE
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United States of America Patent
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Aug 18, 2015
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Aug 29, 2014
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Abstract
Provided is a conductor connection structure (10) in which two conductors (21, 31) are electrically connected by a copper connection part (11). The connection part (11) comprises a material containing mainly copper. The connection part (11) also comprises a plurality of holes. An organosilicon compound is present within the holes. The connection part preferably has a structure in which a plurality of gathered particles are melted and bonded together and the particles have a necking section therebetween. In addition, the connection structure (10) preferably has a structure in which a plurality of large copper particles having a relatively large particle size and a plurality of small copper particles having a particle size smaller than that of the large copper particles are melted and bonded together such that the large copper particles and the small copper particles are bonded together, the small copper particles are bonded together, and a plurality of small copper particles are positioned around one large copper particle.
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