Phenol Resin Foam and Method for Producing the Same
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Jun 17, 2015
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Jun 18, 2014
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Provided is a phenol resin foam that has low initial thermal conductivity and that retains low thermal conductivity for a long period of time. The present phenol resin foam may contain a cyclopentane and a high-boiling hydrocarbon with a boiling point of from 120° C. to 550° C. and may have a density of from 10 kg/m3 to 150 kg/m3. The content of the cyclopentane in the phenol resin foam per 22.4×10−3 m3 space volume in the phenol resin foam is from 0.25 mol to 0.85 mol.
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