Floating liquid cooled heat transfer solution
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United States of America Patent
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Sep 1, 2020
Grant Date -
May 11, 2017
app pub date -
Oct 31, 2016
filing date -
Nov 9, 2015
priority date (Note) -
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Abstract
The present disclosure relates to an apparatus and a method for cooling electronic components. An apparatus of the presently claimed invention includes a connector and an electronic component that plugs into the connector. The electronic component contacts a heat sink, where the heat sink moves in an upward direction as the electronic component is plugged into the connector. Soft thermal pads located between the heat sink and liquid cooling tubes/pipes compress as the heat sink moves upward. When compressed, the thermal pads contact the heat sink and the liquid cooling tubes/pipes. Heat is then transferred from the electronic component through the heat sink, through the thermal pads, through the coolant tubes, and into liquid contained within the liquid coolant tubes.
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