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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
CITIBANK N A	388 GREENWICH STREET NEW YORK NY 10013

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
• H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

• 2015 Application Filing Year
• H01L Class
• 25498 Applications Filed
• 22451 Patents Issued To-Date
• 88.06 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
De, Avila Ribas Morgana	South Plainfield, US	20	56
# of filed Patents : 20 Total Citations : 56
Mukherjee, Sutapa	South Plainfield, US	15	63
# of filed Patents : 15 Total Citations : 63
Pandher, Ranjit	South Plainfield, US	40	143
# of filed Patents : 40 Total Citations : 143
Ramakrishna, Hosur Venkatagiriyappa	South Plainfield, US	1	2
# of filed Patents : 1 Total Citations : 2
Sarkar, Siuli	South Plainfield, US	53	164
# of filed Patents : 53 Total Citations : 164
Singh, Bawa	South Plainfield, US	108	1502
# of filed Patents : 108 Total Citations : 1502

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Patent Citation Ranking

• 2 Citation Count
• H01L Class

• 18.50 % this patent is cited more than
• 8 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Nov 11, 2028

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2017/0135,227

Engineered Residue Solder Paste Technology

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Abstract

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A method of forming a solder joint, the method comprising: (i) providing a solder flux; (ii) providing solder particles; (iii) providing two or more work pieces to be joined; and (iv) heating the solder flux and the solder particles in the vicinity of the two or more work pieces to be joined to form: (i) a solder joint between the two or more work pieces to be joined, and (ii) a solder flux residue. The solder flux residue substantially covers the exposed surfaces of the solder joint.

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Description

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Claims

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