METHOD OF MANUFACTURING MULTI-LAYERED FILM AND MULTI-LAYERED FILM

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United States of America Patent

SERIAL NO

15319602

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A method of manufacturing a multi-layered film at least includes: a step A of forming an electroconductive layer on a substrate; a step B of forming a seed layer so as to coat the electroconductive layer; and a step C of forming a dielectric layer so as to coat the seed layer. In the step B, a compound including strontium (Sr), ruthenium (Ru), and oxygen (O) is formed as the seed layer by a sputtering method. In the step C, where a substrate temperature is defined by Td when the dielectric layer is formed, 560° C.≦Td≦720° C. is determined.

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Patent Owner(s)

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ULVAC INCKANAGAWA JAPAN KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HENMI, Mitsunori Chigasaki-shi, JP 7 2
HIROSE, Mitsutaka Chigasaki-shi, JP 5 2
KIMURA, Isao Chigasaki-shi, JP 90 998
KOBAYASHI, Hiroki Chigasaki-shi, JP 248 1354
SUU, Koukou Chigasaki-shi, JP 55 882
TSUKAGOSHI, Kazuya Chigasaki-shi, JP 5 34

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