Apparatus and sensor chip component attaching method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10026765
APP PUB NO 20170133422A1
SERIAL NO

14937890

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An apparatus includes a lens component and an integrated circuit package. The lens component has a lens and a through hole from a specific surface to a bottom surface of the lens component. The integrated circuit package has a sensor and a second portion on a top surface of the integrated circuit package. The first portion on the bottom surface of the lens component is adjacent and attached to the second portion on the top surface of the integrated circuit package by an adhesive material that is injected via the through hole to the first portion and the second portion, for fixing the lens component to the integrated circuit package.

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Patent Owner(s)

Patent OwnerAddress
PIXART IMAGING (PENANG) SDN BHDPENANG PULAU

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Sai Mun Penang, MY 44 338
T'Ng, Chee Pin Penang, MY 3 1

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