SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR DEVICE

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United States of America Patent

SERIAL NO

15300472

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Abstract

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A semiconductor substrate including: substrate; buffer layer provided on substrate; high-resistance layer provided on buffer layer, high-resistance layer being composed of nitride-based semiconductor and containing transition metal and carbon; and channel layer provided on high-resistance layer, channel layer being composed of nitride-based semiconductor, wherein high-resistance layer includes reduction layer in contact with channel layer, reduction layer being layer in which concentration of transition metal is reduced from side where buffer layer is located toward side where channel layer is located, and reduction rate at which carbon concentration is reduced toward channel layer is higher than reduction rate at which concentration of transition metal is reduced toward channel layer. As a result, it is possible to provide a semiconductor substrate that can make higher resistance of region of high-resistance layer on side where channel layer is located while reducing carbon concentration and transition metal concentration in channel layer.

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Patent Owner(s)

Patent OwnerAddress
SANKEN ELECTRIC CO LTD3-6-3 KITANO NIIZA-SHI SAITAMA-KEN 352-8666
SHIN-ETSU HANDOTAI CO LTD2-1 OHTEMACHI 2-CHOME CHIYODA-KU TOKYO 1000004

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
GOTO, Hirokazu Minato-ku, JP 49 988
HAGIMOTO, Kazunori Takasaki, JP 41 187
SATO, Ken Miyoshi-machi, JP 116 1112
SHIKAUCHI, Hiroshi Niiza-shi, JP 31 69
SHINOMIYA, Masaru Annaka, JP 29 87
TSUCHIYA, Keitaro Takasaki, JP 30 59

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