HYBRID PIN CONNECTING APPARATUS FOR OPTOELECTRONIC DEVICES
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United States of America Patent
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app pub date -
Nov 10, 2015
filing date -
Nov 10, 2015
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Abstract
A hybrid pin connecting apparatus and method for connecting a thermally susceptible high-speed optoelectronic device to a PCB, comprising a combination of one or more flat pins or gull wing pins capable of transmitting high-speed electrical signals above 5 Gbps for being locally soldered to one or more matching surface mount pads on the PCB, and a pin grid array capable of transmitting only low-speed electrical signals below 5 Gbps mounted on the substrate for fitting into and connecting to a geometrically matching array of through-hole connections on the PCB.
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