Conductive paste

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United States of America Patent

PATENT NO 10702954
APP PUB NO 20170129058A1
SERIAL NO

15127406

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Abstract

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A conductive paste including (A) a silver powder, (B) a glass frit, (C) an organic binder and (D) a powder containing Cu and at least one metal element selected from the group consisting of V, Cr, Mn, Fe and Co. The powder (D) may thus contain Cu and Mn, Cu and Fe or Cu and Co. The conductive paste has a desirable electromigration resistance, solder heat resistance and adhesiveness to a substrate.

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Patent Owner(s)

Patent OwnerAddress
NAMICS CORPORATIONNIIGATA-SHI NIIGATA 950-3131

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yoshii, Yoshiaki Niigata, JP 3 6

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