ELECTRONIC DEVICE EQUIPPED WITH A HEAT SINK
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United States of America Patent
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Issued Date -
May 4, 2017
app pub date -
Apr 18, 2016
filing date -
Oct 28, 2015
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Abstract
An electronic device includes a support plate with an integrated circuit chip fixed onto the support plate. A heat sink is mounted to the support plate. An electrical connection wire is provided with one end electrically connected to the heat sink and another end electrically connected to an electrical contact provided on the support plate.
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