Generation of a Splice Between Superconductor Materials
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Apr 21, 2015
filing date -
Apr 25, 2014
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
Technologies are described for methods and systems to generate a splice between a first and a second piece of conductor material. The methods may comprise identifying a first overlap area for the first piece on a first conductive surface. The first piece may include the first conductive surface and a first non-conductive surface. The methods may comprise identifying a second overlap area for the second piece on a second conductive surface. The second piece may include the second conductive surface and a second non-conductive surface. The methods may comprise pre-tinning the first and second overlap areas with solder to produce first and second pre-tinned areas. The methods may comprise stacking the first and second pieces so that the first and second pre-tinned areas are in contact and applying heat to the first non-conductive surface sufficient to melt the solder and generate the splice between the first and second pieces.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully