METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
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United States of America Patent
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app pub date -
Dec 22, 2014
filing date -
Dec 26, 2013
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Abandoned
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Abstract
Provided is a method for producing a semiconductor package. By this method, a periphery of a light-exposure planning region can be prevented from being exposed to light. The method is a semiconductor package producing method in which a film-formation planning surface of a cured product has a surface roughness of a predetermined value or less.
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