METHOD FOR MANUFACTURING SEMICONDUCTOR AND METHOD FOR CLEANING WAFER SUBSTRATE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Mar 31, 2015
filing date -
Mar 31, 2014
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
An object of the present invention is to provide a method for manufacturing a semiconductor, including a step of removing a photoresist present on a patterned wafer substrate and having a hardened modified layer, which is difficult to remove, formed on at least part of a top portion easily and effectively under mild conditions, and a method for cleaning a wafer substrate, including the above step. The method for manufacturing a semiconductor of the present invention as a means for resolution is characterized by comprising a step of bringing a patterned wafer substrate, on which a photoresist having a hardened modified layer formed on at least part of a top portion is present, into contact with a carbon dioxide dissolved water containing ozone-containing microbubbles, thereby removing the photoresist. In addition, the method for cleaning a wafer substrate of the present invention is characterized by comprising the above step.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully